Display device and method of manufacturing the same

ABSTRACT

A display device is provided. The display device includes a substrate including a display area, an opening area disposed in the display area, a first non-display area at least partially surrounding the display area, and a second non-display area at least partially surrounding the opening area. A display layer is disposed in the display area. An encapsulating substrate covers the display layer and has an opening corresponding to the opening area. A sealing portion is disposed between the encapsulating substrate and the substrate. The sealing portion is disposed in the opening area and connects the encapsulating substrate to the substrate. A partition wall is disposed between the substrate and the sealing portion.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims the benefit of and priority to Korean PatentApplication No, 10-2019-0062054, filed on May 27, 2019, in the Koreanintellectual Property Office, the present disclosure of which isincorporated by reference herein in its entirety.

TECHNICAL FIELD

The present disclosure relates to a display device, and moreparticularly, to a display device and a method of manufacturing thedisplay device.

DISCUSSION OF THE RELATED ART

In recent years, physical buttons and the like have been removed fromthe front surface of various electronic devices that incorporate displaydevices, such as smartphones and the line. Additionally, display areasfor displaying images have been enlarged so as to take up a highperportion of the front surface of the electronic devices. Assmartphones, and other similar devices, often incorporate a front-facingcamera proximate to the display, as the size of the display increasesrelative to the size of the front surface of the smartphone, there mightnot be sufficient non-display area on the front surface of theelectronic devices to accommodate the front-facing camera and/or otherelements. For example, a display device has been introduced intosmartphones and other electronic devices in which a separate member forexpanding the functionality of the display device, for example, a cameraand/or various other elements, are arranged within a display area so asto enlarge the display area further.

In order to arrange a separate member, such as a camera, in the displayarea, a groove, notch, or other opening may be formed in the displayarea. The separate member may then be placed within the groove, notch,or other opening.

SUMMARY

A display device includes a substrate including a display area, anopening area disposed in the display area, a first non-display areasurrounding at least a portion of the display area, and a secondnon-display area at least partially surrounding at least a portion ofthe opening area. A display layer is disposed in the display area. Anencapsulating substrate covers the display layer and has an openingcorresponding to the opening area. A sealing portion is disposed betweenthe encapsulating substrate and the substrate, the sealing portion beingdisposed in the opening area and connecting the encapsulating substrateto the substrate. A partition wall is disposed between the substrate andthe sealing portion.

The sealing portion may be in direct contact with at least a portion ofthe partition wall.

The partition wall may include an inorganic layer and/or an organiclayer.

The sealing portion may be in contact with the organic layer of thepartition wall.

An inner surface of the opening of the encapsulating substrate mayprotrude from an inside of the sealing portion to a center of theopening.

The substrate and the encapsulating substrate may respectively includealignment marks disposed at positions corresponding to each other.

A method of manufacturing a display device includes forming a displaylayer on a substrate. A sealing portion is arranged on the substrate. Anencapsulating substrate is arranged to face the substrate, theencapsulating substrate including an opening corresponding to an openingarea of the substrate. The substrate is coupled to the encapsulatingsubstrate with by sealing portion. A cleaning liquid is supplied throughthe opening to remove a portion of the display layer inside the opening.

The cleaning liquid may remove an opposite electrode and/or anintermediate layer in the display layer.

The method may further include forming a partition wall in the openingarea corresponding to the opening.

The partition wall may be arranged in correspondence with a positionwhere the sealing portion is disposed.

An inner surface of the opening of the encapsulating substrate mayprotrude from the inside of the sealing portion to the center of theopening.

The opening of the encapsulating substrate may be formed by a laser or adrill.

The encapsulating substrate may include plastic and be formed by anextrusion process.

The method may further include aligning the substrate with theencapsulating substrate.

A method of manufacturing a display device includes forming anintermediate layer in both a display area and an opening area of asubstrate and forming an opposite electrode on the substrate except forin the opening area. A sealing portion is arranged in the opening area.An encapsulating substrate is arranged to face the substrate. Theencapsulating substrate includes an opening corresponding to the openingarea. The substrate is coupled to the encapsulating substrate with thesealing portion. A cleaning liquid is supplied through the opening toremove the intermediate layer inside the opening.

The method may further include aligning the substrate with theencapsulating substrate.

The method may further include forming a partition wall on thesubstrate.

At least a portion of the sealing portion may be arranged on thepartition wall.

The partition wall may include an inorganic layer and/or an organiclayer.

The opening may be formed by a laser or a drill, or may be formed duringextrusion molding of the encapsulating substrate.

BRIEF DESCRIPTION OF THE DRAWINGS

A more complete appreciation of the present disclosure and many of theattendant aspects thereof will become apparent and more readilyappreciated from the following description of the embodiments, taken inconjunction with the accompanying drawings, in which:

FIG. 1 is a perspective view illustrating a display device according toan exemplary embodiment of the present disclosure;

FIG. 2 is a cross-sectional view illustrating a display device accordingto an exemplary embodiment of the present disclosure;

FIG. 3 is a cross-sectional view illustrating a display device accordingto an exemplary embodiment of the present disclosure;

FIG. 4 is a plan view illustrating a display panel according to anexemplary embodiment of the present disclosure;

FIG. 5 is an equivalent circuit diagram of a pixel of a display panelaccording to an exemplary embodiment of the present disclosure;

FIG. 6 is a cross-sectional view illustrating an example of a crosssection taken along line B-Be in FIG. 4;

FIGS. 7 to 9 are cross-sectional views illustrating a method ofmanufacturing the display panel shown in FIG. 6;

FIG. 10 is a cross-sectional view illustrating a display panel accordingto an exemplary embodiment of the present disclosure;

FIGS. 11 to 13 are cross-sectional views illustrating a method ofmanufacturing the display panel shown in FIG. 10;

FIG. 14 is a cross-sectional view illustrating a display panel accordingto an exemplary embodiment of the present disclosure;

FIGS. 15 and 16 are cross-sectional views illustrating a method ofmanufacturing the display panel shown in FIG. 14;

FIG. 17 is a cross-sectional view illustrating display panel accordingto an exemplary embodiment of the present disclosure;

FIGS. 18 and 19 are cross-sectional views illustrating a method ofmanufacturing the display panel shown in FIG. 17;

FIG. 20 is a cross-sectional view illustrating a display panel accordingto an exemplary embodiment of the present disclosure;

FIG. 21 is a cross-sectional view illustrating a display panel accordingto an exemplary embodiment of the present disclosure;

FIG. 22 is a cross-sectional view illustrating a display panel accordingto exemplary embodiment of the present disclosure;

FIG. 23 is a cross-sectional view illustrating a display panel accordingto an exemplary embodiment of the present disclosure; and

FIG. 24 is a cross-sectional view illustrating a display panel accordingto an exemplary embodiment of the present disclosure.

DETAILED DESCRIPTION

In describing exemplary embodiments of the present disclosureillustrated in the drawings, specific terminology is employed for sakeof clarity. However, the present disclosure is not intended to belimited to the specific terminology so selected, and it is to beunderstood that each specific element includes all technical equivalentswhich operate in a similar manner.

Like or corresponding reference numerals in the drawings and writtendescription may denote like elements and to the extent that adescription of an element has been omitted, it may be assumed that theomitted description is at least similar to the description ofcorresponding elements that are described elsewhere within the writtendescription.

It will be understood that although the terms “first”, “second”, etc.may be used herein to describe various components, these components arenot necessarily limited by these terms and these terms are used todistinguish one component from another.

It will be further understood that the terms “comprises,” “includes,”“comprising,” and/or “including” used herein specify the presence ofstated features or components, but do not preclude the presence oraddition of one or more other features or components.

It will be understood that when a layer, region, or component isreferred to as being “formed on,” another layer, region, or component,it may be directly or indirectly formed on the other layer, region, orcomponent. For example, intervening layers, regions, or components maybe present.

Sizes of elements in the drawings may be exaggerated or reduced forconvenience of description. While the relative sizes and angles of theelements illustrated in the figures may be taken as showing a particularembodiment of the present inventive concept, other embodiments are notnecessarily limited to the relative sizes and angles shown.

In the following embodiments, the x-axis, the y-axis, and the z-axis arenot limited to three axes of the rectangular coordinate system, and maybe interpreted in a broader sense. For example, the x-axis, the y-axis,and the z-axis need not be perpendicular to one another.

The particular order of steps described and illustrated hereinrepresents some, but not all embodiments of the present inventiveconcept and so other embodiments may perform similar or identical stepsin different orders or at the same time.

FIG. 1 is a perspective view illustrating a display device 10 accordingto an exemplary embodiment of the present disclosure.

Referring to FIG. 1, the display device 1 may include a display area DA,an opening area OP, a first non-display area NDA1 and a secondnon-display area NDA2. The display device 1 may provide an image usinglight emitted from pixels arranged in the display area DA.

The opening area OP may be disposed in the display area DA. In thiscase, the fir non-display area NDA1 and the second non-display area NDA2may be spaced apart from each other and the opening area OP may beentirely surrounded by the display area DA. The opening area OP may havevarious shapes. For example, the opening area OP may have a circularshape, a polygonal shape, an elliptical shape, or some combination ofone or more of these shapes. Hereinafter, for convenience ofdescription, the case where the opening area OP has a circular shapewill be mainly described in detail. However, it is to be understood thatthe opening area OP may have any arbitrary shape.

The first non-display area NDA1 is an area in which pixels are notarranged, and the first non-display area NDA1 may surround the displayarea DA. The second non-display area NDA2 is also an area in whichpixels are not arranged, and the second non-display area NDA2 maysurround the opening area OP.

Hereinafter, an organic light-emitting display device will be describedas at example of the display device 1 according to an exemplaryembodiment of the present inventive concept, but the display device 1 isnot limited thereto. For example, various types of display devices suchas an inorganic electroluminescence (EL) display (e.g., inorganiclight-emitting display) and a quantum dot light-emitting display may beused. In some embodiments, each pixel of the display device 1 mayinclude an emission layer, and the emission layer may include an organicmaterial, may include an inorganic material, may include a quantum dot,may include an organic material and a quantum dot, and/or may includean, inorganic material and a quantum dot.

FIG. 2 is a cross-sectional view illustrating a display device 1according to an exemplar embodiment of the present disclosure.

Referring to FIG. 2, the display device 1 may include a display panel 10and an input sensing member 40 such as a touch-sensor. The display panel10 may display an image by using pixels arranged in a display area DA.

The display panel 10 may include a substrate 100, a display layer D, asealing portion 600, and an encapsulating substrate 700. The sealingportion 600 may include a first sealing portion 600A disposed in thefirst non-display area NDA1 and a second sealing portion 600B disposedin the second non-display area NDA2. The first seating portion 600A maybe disposed at the edges of the substrate 100 and the encapsulatingsubstrate 700 to connect the substrate 100 to the encapsulatingsubstrate 700. The second sealing portion 600B may be disposed in theopening area OP to completely surround the opening area OP. In thiscase, the second sealing portion 600B may be formed in a cylindricalshape having a space therein (e.g. a ring-shaped element) and may bedisposed between the substrate 100 and the encapsulating substrate 700.

The input sensing member 40 may be disposed on the display panel 10. Theinput sensing member 40 may include an electrode disposed in the form ofa pattern on the encapsulating substrate 700 of the display panel 10.The input sensing member 40 may receive a signal according to a touchoperation when a user touches the display device 1 with a finger orimplement, such as a stylus.

The display device 1 may further include an optical functional member 50disposed on the input sensing member 40. The optical functional member50 may reduce the reflectance of light (i.e., external light) incidentfrom the outside toward the display panel 10 and/or may increase thecolor purity of light emitted from the display panel 10.

In an exemplary embodiment of the present disclosure, the opticalfunctional member 50 may include a phase retarder and a polarizer. Thephase retarder may be of a film type or a liquid crystal coating type,and may include a (λ/2) phase retarder and/or a (λ/4) phase retarder.The polarizer may also be of a film type or a liquid crystal coatingtype. The film type may include a stretchable synthetic resin film, andthe liquid crystal coating type may include liquid crystals arranged ina predetermined arrangement. Each of the phase retarder and thepolarizer may further include a protective film. The phase retarder andthe polarizer itself or the protective film may be defined as a baselayer of the optical functional member 50.

In an exemplary embodiment of the present disclosure, the opticalfunctional member 50 may include a black matrix and/or color filters.The color filters may be arranged in consideration of the color of lightemitted from each of the pixels of the display panel 10. Each of thecolor filters may include a red, green or blue pigment or dye.Alternatively, each of the color filters may further include quantumdots in addition to the pigment or dye described above. Alternatively,some of the color filters might not include the pigment or dye describedabove and may include scattering particles such as titanium oxide.

In an exemplary embodiment of the present disclosure, the opticalfunctional member 50 may include a destructive interference structure.The destructive interference structure may include a first reflectivelayer and a second reflective layer disposed on different layers. Firstreflected light and second reflected light reflected from the firstreflective layer and the second reflective layer, respectively, maydestructively interfere, and thus, external light reflectance may bereduced.

The process of forming the optical functional member 50 may be performedseparately from the process of forming the input sensing member 40, andin this case, an adhesive film such as an optical transparent adhesivemember (OCA) may be disposed between the optical functional member 50and the input sensing member 40, as shown in FIG. 2. In an exemplaryembodiment of the present disclosure, the process of forming the opticalfunctional member 50 may be continuously performed after the process offorming the input sensing member 40, and in this case, an adhesive filmmight not be disposed between the optical functional member 50 and theinput sensing member 40.

The display device 1 may further include a protective member 60 disposedon the optical functional member 50. The protective member 60 mayinclude glass. According to an exemplary embodiment of the presentdisclosure, the protective member 60 may include a coating layerdisposed on the glass. According to an exemplary embodiment of thepresent disclosure, the protective member 60 may include a plasticmaterial. The protective member 60 may include a plurality of layersother than a single layer.

The display device 1 may include a cover member 70 disposed on a lowersurface of the display panel 10. The cover member 70 may be in variousforms. For example, the cover member 70 may include a film adhered tothe substrate 100 of the display panel 10. According to an exemplaryembodiment of the present disclosure, the cover member 70 may include acase in which the substrate 100 of the display panel 10 is seated. Inthis case, the cover member 70 may be supported by arranging a componentCMP.

The opening area OP of the display device 1 may be a component area inwhich the component CMP for adding various functions to the displaydevice 1 is disposed. The component CMP may include one or moreelectronic elements. For example, the component CMP may include anelectronic element that uses (e.g. generates and/or senses) light orsound. For example, the electronic element may include a sensor (e.g.,an infrared sensor) that outputs and/or receives light, a camera thatcaptures an image by receiving light, a sensor that outputs and senseslight or sound to measure distance or recognize fingerprints, a smalllamp or flash that outputs light, a speaker that outputs sound, or thelike. The electronic element using light may use light of a specificwavelength band, for example, visible light, infrared light, andultraviolet light. In some embodiments, the opening area OP may beunderstood as a transmission area through which light or/and sound,which is output from the component CMP to the outside or travels fromthe outside toward the electronic element, may pass.

When the display device 1 provides specific information, like in a smartwatch or a car dashboard, the component CMP may be an element such as aneedle, hand, or dial indicating certain information (e.g., vehiclespeed, amount of fuel, and time, such as clock hands). Alternatively,the component CMP may include a component such as a lamp or accessoriesthat increase the aesthetic sensibility of the display device 1.

The display panel 10, the input sensing member 40, and the opticalfunctional member 50, as described above, may include openingscorresponding to the opening area OP. In this case, an opening of thedisplay panel 10, an opening 41 of the input sensing member 40, and anopening 51 of the optical functional member 50 may be disposed in theopening area OP and may all overlap each other so as to form acontinuous opening. The opening of the display panel 10 may be in theform of a groove, and the opening 41 of the input sensing member 40 andthe opening 51 of the optical functional member 50 may be in the form ofa hole.

FIG. 3 is a cross-sectional view illustrating a display device 1′according to an exemplary embodiment of the present disclosure. In FIG.3, the same reference numerals as used in FIG. 2 may denote the same orsimilar members as those in FIG. 2.

Referring to FIG. 3, the display device 1′ may include a display panel10 and an input sensing member 40. The display panel 10 may display animage by using pixels arranged in a display area DA.

The input sensing member 40 acquires coordinate information according toan external input, for example, a touch event. The input sensing member40 may include a sensing electrode (or touch electrode) and a trace line(or signal wiring) connected to the sensing electrode. The input sensingmember 40 may be disposed on the display panel 10.

A resin layer, for example, an optically clean resin (OCR) layer, may bedisposed between the display panel 10 and the input sensing member 40.The resin layer is distinguished from a film-type adhesive having aconstant thickness. The resin layer may include a photo-curable resin,for example, an ultraviolet (UV)-curable resin. The resin layer mayinclude an acrylic resin, for example, an acrylic ester-based material.

The display panel 10, the input sensing member 40, and an opticalfunctional member 50 may each include openings. In this case, an openingof the display panel 10, an opening 41 of the input sensing member 40,and an opening 51 of the optical functional member 50 may all bedisposed in an opening area OP and may overlap each other so as to forma single continuous opening. The opening of the display panel 10, theopening 41 of the input sensing member 40 and the opening 51 of theoptical functional member 50 may be in the form of a hole.

According to an exemplary embodiment of the present disclosure, theoptical functional member 50 may be disposed on the display panel 10 andthe input sensing member 40 may be disposed on the optical functionalmember 50. Also, a protective member 60 may be disposed on the inputsensing member 40.

FIG. 4 is a plan view illustrating a display panel 10 according to anexemplary embodiment of the present disclosure.

Referring to FIG. 4, the display panel 10 may include a display area DA,an opening area OA, a first non-display area NDA1, and a secondnon-display area NDA2, with the first non-display area NDA1 and thesecond non-display area NDA2 together comprising the non-display areaNDA.

At least one pixel P may be arranged in the display area DA. A pluralityof pixels P may be provided and the plurality of pixels P may implementdifferent colors. For example, each of the pixels P may implement red,green, and/or blue. According to an exemplary embodiment of the presentdisclosure, each of the pixels P may implement red, yellow, and/or blue.Colors implemented by the pixels P are not limited exclusively to thosedescribed above and may include various colors.

In addition to the above case, the pixel P may also implement whitelight. In this case, the display panel 10 may include a separate colorfilter.

An opening of the display panel 10 may be disposed in an opening areaOP. The opening may be formed in a groove shape in the display panel 10.The opening may be in a state in which some of the layers or members ofthe display panel 10 have been removed. The opening area OP may transmitlight.

The display panel 10 may include a driving unit such as a scan driverand a data driver liar transmitting predetermined signals to each pixelP of the display area DA. The driving unit may be disposed in the firstnon-display area NDA1 and the second non-display area NDA2. In addition,pads connected to the driving unit and connected to an external circuitboard or the like may be disposed in the second non-display area NDA2.

FIG. 5 is an equivalent circuit diagram of a pixel P of a display panelaccording to an exemplary embodiment of the present disclosure.

Referring to FIG. 5, the pixel P may include a pixel circuit PC and adisplay element connected to the pixel circuit PC, for example, anorganic light-emitting diode OLED. The pixel circuit PC may include afirst thin film transistor T1, a second thin film transistor T2, and astorage capacitor Cst. The pixel P may emit, for example, red, green,blue, or white light through the organic light-emitting diode OLED.

The second thin film transistor T2 is a switching thin film transistorand is connected to a scan line SL and a data line DL, and may transfera data voltage input from the data line DL to the first thin filmtransistor T1 based on a switching voltage input from the scan line SL.The storage capacitor Cst may be connected to the second thin filmtransistor T2 and a driving voltage line PL and may store a voltagecorresponding to a difference between a voltage transferred from thesecond thin film transistor T2 and a first power voltage ELVDD suppliedto the driving voltage line PL.

The first thin film transistor T1 is a driving thin film transistor andma be connected to the driving voltage line PL and the storage capacitorCst and may control a driving current flowing through the organiclight-emitting diode OLED from the driving voltage line PL in responseto the voltage value stored in the storage capacitor Cst. The organiclight-emitting diode OLED may emit light having predetermined brightnessby using; the driving current. An opposite electrode (e.g. a cathode) ofthe organic light-emitting diode OLED may receive a second power voltageELVSS.

FIG. 5 illustrates that the pixel circuit PC includes two thin filmtransistors and one storage capacitor, but the present disclosure is notlimited exclusively thereto. The number of thin film transistors and thenumber of storage capacitors may be variously changed according to thedesign of the pixel circuit PC. For example, the pixel circuit PC mayfurther include four or more thin film transistors in addition to theabove-mentioned two thin film transistors.

FIG. 6 is a cross-sectional view illustrating an example of a crosssection taken along a line B-B′ in FIG. 4.

Referring to FIGS. 4 and 6, the display panel 10 includes a substrate100, a pixel array PA, a sealing portion 600B, and an encapsulatingsubstrate 700.

The substrate 100 may include glass or polymer resin. The polymer resinmay include polyethersulphone, polyacrylate, polyarylate,polyetherimide, polyethylene naphthalate, polyethylene terephthalate,polyphenylene sulfide, polyimide, polycarbonate, and/or celluloseacetate propionate. The substrate 100 may have a multi-layered structureincluding a layer including the aforementioned polymer resin and aninorganic layer. Hereinafter, for convenience of description, the casewhere the substrate 100 includes glass will be mainly described indetail.

A through hole 710 is disposed in the display area DA of the substrate100. The through hole 710 is a hole passing through the encapsulatingsubstrate 700 and is surrounded by the pixel array PA disposed in thedisplay area DA and including a plurality of pixels P.

Each pixel P of the pixel array PA includes a pixel circuit and alight-emitting element electrically connected to the pixel circuit, forexample, an organic light-emitting diode, and provides an image vialight emitted from the light-emitting element.

The sealing portion 600B may be disposed between the substrate 100 andthe encapsulating substrate 700. The encapsulating substrate 700 mayface the substrate 100. In this case, the encapsulating substrate 700may include a material that is the same as or similar to that of thesubstrate 100. The encapsulating substrate 700 may include glass and/orplastic. The encapsulating substrate 700 may include at least one layerincluding at least one resin.

The encapsulating substrate 700 may be formed to include the throughhole 710 or the through hole 710 may be made after the encapsulationsubstrate 700 has been made, for example, by drilling, laser, or thelike.

The inner surface of the through hole 710 of the encapsulating substrate700 may protrude from the inner surface of the sealing portion 600Btoward the center of the through hole 710. For example, a distance Dfrom the inner surface of the sealing portion 600B to the inner surfaceof the through hole 710 of the encapsulating substrate 700 may be in therange of 100 μm to 2000 μm.

The through hole 710 is surrounded by the pixels P, and an area where apixel p is not provided, for example, a second non-display area NDA2, isdisposed between the through hole 710 and the pixels P. In this case, apattern portion 300A is disposed in the second non-display area NDA2.

The pattern portion 300A includes a recess 310A and/or a cladding layercovering the recess 310A. Hereinafter, for convenience of description,the case where the pattern portion 300A includes the recess 310A will bemainly described in detail.

The recess 310A may be a kind of groove formed in the thicknessdirection of an insulating layer 110 disposed on the substrate 100.

The insulating layer 110 haying the recess 310A is an inorganic layerand may include a single inorganic layer or a plurality of inorganiclayers. For example, the insulating layer 110 may include an inorganicmaterial such as silicon oxide, silicon nitride, silicon oxynitride,and/or the like.

An auxiliary recess 315 may be disposed between the through hole 710 andthe pattern portion 300A. The auxiliary recess 315 may be connected tothe through hole 710 spatially as a space concavely formed at the end ofthe insulating layer 110 adjacent to the through hole 710.

A pixel circuit 200 and a light-emitting element 500 are disposed in thedisplay area DA. The pixel circuit 200 and the light-emitting element500 may form a display layer.

The light-emitting element 500 includes a pixel electrode 510electrically connected to the pixel circuit 200 with a via insulatinglayer 130 disposed therebetween, an opposite electrode 530 facing thepixel electrode 510, and an intermediate layer 520 disposed between thepixel electrode 510 and the opposite electrode 530, and the viainsulating layer 130 has a via hole. In an exemplary embodiment of thepresent disclosure, the via insulating layer 130 may include aninsulating organic material.

The pixel electrode 510 may be exposed through an opening provided in apixel-defining layer 150 and the edge of the pixel, electrode 510 may becovered with the pixel-defining layer 150 including an insulatingorganic material. In an exemplary embodiment of the present disclosure,the pixel electrode 510 may include silver (Ag), magnesium (Mg),aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni),neodymium (Nd), iridium (Ir), chromium (Cr), or a compound thereof.

The opposite electrode 530 may be integrally formed to entirely coverthe display area DA. In an exemplary embodiment of the presentdisclosure, the opposite electrode 530 may include a thin metal layercontaining Ag and/or Mg, or a transparent conductive oxide (TCO) layerincluding indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide(ZnO), indium oxide (In₂O₃), indium gallium oxide (ITO), and/or aluminumzinc oxide (AZO).

The intermediate layer 520 includes an emission layer 522. The emissionlayer 522 may include an organic material including a fluorescent orphosphorescent material that emits light of one of red, green, and blue,and may be patterned corresponding to the pixel P in the display areaDA.

The emission layer 522 may be patterned such that patterns thereof arespaced apart from each other over the entire region of the substrate100. In this case, the emission layer 522 may correspond to the pixel P,as described above, and may be disposed in the second non-display areaNDA2 or the opening area OP. For example, the emission layer 522 mayinclude a first dummy emission layer 522A disposed in the secondnon-display area NDA2 and a second dummy emission layer disposed in theopening area OP. Although only one first dummy emission layer 522A isshown in FIG. 6, the present disclosure is not limited thereto and oneor more first dummy emission layers 522A and one or more second dummyemission layers may be provided. For example, when a plurality of firstdummy emission layers 522A and a plurality of second dummy emissionlayers are provided, the plurality of first dummy emission layers 522Amay be spaced apart from each other in the second non-display area NDA2and the plurality of second dummy emission layers may be spaced apartfrom each other in the opening area OP. According to an exemplaryembodiment of the present disclosure, the first dummy emission layer522A and the second dummy emission layer might not be formed when theemission layer 522 is formed.

The intermediate layer 520 may include a first functional layer 521disposed between the emission layer 522 and the pixel electrode 510and/or a second functional layer 523 disposed between the emission layer522 and the opposite electrode 530.

The first functional layer 521 may include a hole injection layer (HIL)and/or a hole transport layer (HTL). The HIL allows holes to be easilyemitted from an anode, and the HTL allows the holes of the HIL to betransmitted to the emission layer 522.

The HIL may include a phthalocyanine compound such as copperphthalocyanine,DNTPD(N,N′-diphenyl-N,N′-bis-[4-(phenyl-m-tolyl-amino)-phenyl]-biphenyl-4,4′-diamine),m-MTDATA(4,4′,4″-tris(3-methylphenylphenylamino) triphenylamine),TDATA(4,4′,4″-Tris(N,N-diphenylamino)triphenylamine),2T-NATA(4,4′,4″-tris{N,-(2-naphthyl)-N-phenylamino}-triphenylamine),PEDOT/PSS(Poly(3,4-ethylenedioxythiophene)/Poly(4-styrenesulfonate)),Pani/DBSA(Polyaniline/Dodecylbenzenesulfonic acid),Pani/CSA(Polyaniline/Camphor sulfonicacid), orPANI/PSS(Polyaniline)Poly(4-styrenesulfonate), but it is not limitedthereto.

The HTL may include a carbazole derivative such as N-phenylcarbazole orpolyvinylcarbazole,TPD(N,N′-bis(3-methylphenyl)-N,N-diphenyl-[1,1-biphenyl]-4,4′-diamine),NPB(N,N′-di(1-naphthyl)-N,N′-diphenylbenzidine), or atriphenylamine-based material such asTCTA(4,4′,4″-tris(N-carbazolyl)triphenylamine), but it is not limitedthereto.

The second functional layer 523 may include an electron transport layer(ETL) and/or an electron injection layer (EIL). The EIL allows electronsto be easily emitted from a cathode, and the ETL allows the electrons ofthe EIL to be transmitted to the emission layer 522.

The ETL may include Alq3,BCP(2,9-Dimethyl-4,7-diphenyl-1,10-phenanthroline),Bphen(4,7-Diphenyl-1,10-phenanthroline),TAZ(3-(4-Biphenylyl)-4-phenyl-5-tert-butylphenyl-1,2,4-triazole),NTAZ(4-(Naphthalen-1-yl)-3,5-diphenyl-4H-1,2,4-triazole),tBu-PBD(2-(4-Biphenylyl)-5-(4-tert-butylphenyl)-1,3,4-oxadiazole),BAlq(Bis(2-methyl-8-quinolinolato-N1,O8)-(1,1′-Biphenyl-4-olato)aluminum),Bebq2(beryllium bis(benzoquinolin-10-olate)), orADN(9,10-di(naphthalene-2-yl)anthrascene, but it is not limited thereto.

The EIL may include a material such as LiF, NaCl, CsF, Li₂O, BaO, orLiq, but it is not limited thereto.

The first functional layer 521 and the second functional layer 523 mightnot be present in the opening area OP. The first and second functionallayers 521 and 523 may be formed to cover not only the display area DAbut also the second non-display area NDA2 surrounding the through hole710 during the manufacturing process of the display device 1, and thenan area corresponding to the opening area OP may be removed. Accordingto an exemplary embodiment of the present disclosure, the firstfunctional layer 521 and the second functional layer 523 may bepatterned together with the emission layer 522, and thus, patterns ofthe first functional layer 521 may be spaced apart from each other andpatterns of the second functional layer 521 may be spaced apart fromeach other. In this case, the first functional layer 521, the emissionlayer 522, and the second functional layer 523 may be stacked to formintermediate layers 520, and the intermediate layers 520 may be spacedapart from each other. According to an exemplary embodiment of thepresent disclosure, the emission layer 522 may be formed by patterningin the same manner as described above, and the first functional layer521 and the second functional layer 523 may be formed exclusively in thedisplay area DA. Hereinafter, for convenience of description, the casewhere the first functional layer 521 and the second functional layer 523are formed over the entire surface of the substrate 100 and then an areacorresponding to the opening area OP is removed will be mainly describedin detail.

The pixel circuit 200 includes a thin film transistor 210 and a storagecapacitor 220. The insulating, layer 110 may include a buffer layer 101,a gate insulating layer 103, and an interlayer insulating layer 107sequentially disposed on the substrate 100.

The buffer layer 101 is disposed on the substrate 100 to prevent thepermeation of impurities, the gate insulating layer 103 is disposedbetween a semiconductor layer 211 and a gate electrode 213 of the thinfilm transistor 210, and the interlayer insulating layer 107 is disposedbetween the gate electrode 213 of the thin film transistor 210 and thesource electrode 215S and the drain electrode 215D of the thin filmtransistor 210.

Each of the buffer layer 101, the gate insulating layer 103, and theinterlayer insulating layer 107 include an insulating inorganicmaterial. For example, each of the buffer layer 101, the gate insulatinglayer 103, and the interlayer insulating layer 107 may include siliconnitride, silicon oxide, and/or silicon oxynitride.

The recess 310A of the pattern portion 300A is concavely formed alongthe thickness direction of the insulating layer 110. The recess 310A maybe formed by etching the interlayer insulating layer 107, and the fineinsulating layer 103 until a portion of the buffer layer 101 is exposedtherethrough. An etch process for forming the recess 310A may be a dryetching process and may be performed together in a process of forming acontact hole for connecting the semiconductor layer 211 of the thin filmtransistor 210 to each of the source electrode 215S and the drainelectrode 215D.

The thin film transistor 210 and the storage capacitor 220 of the pixelcircuit 200 may be disposed at different positions.

The insulating layer 110 may include the, buffer layer 101, the gateinsulating layer 103, and the interlayer insulating layer 107 which aresequentially disposed on the substrate 100, depending on the structureof the pixel circuit 200. The interlayer insulating layer 107 may bedisposed between the lower electrode 221 and the upper electrode 223 ofthe storage capacitor 220 to function as a dielectric.

Although FIG. 6 illustrates the case where the thin film transistor 210of the pixel circuit 200 is of a top gate type, the present disclosureis not limited thereto. According to an exemplary embodiment of thepresent disclosure, the thin film transistor 210 may be of a bottom gatetype. In addition, although FIG. 6 illustrates the case where the lowerelectrode 221 of the storage capacitor 220 is disposed on the same layeras the gate electrode 213 so that the lower electrode 221 and the gateelectrode 213 include the same material, and the upper electrode 223 ofthe storage capacitor 220 is disposed on the same layer as the sourceelectrode 215S and the drain electrode 215D so that the upper electrode223, the source electrode 215S, and the drain electrode 215D include thesame material, the present disclosure is not limited thereto. Inaddition, although FIG. 6 illustrates the case where the thin filmtransistor 210 and the storage capacitor 220 do not overlap each otherand the gate electrode 213 of the thin film transistor 210 correspondsto the lower electrode 221 of the storage capacitor 220, the presentdisclosure is not limited thereto.

FIGS. 7 to 9 are cross-sectional views illustrating a method ofmanufacturing the display panel 10 shown in FIG. 6.

Referring to FIGS. 7 to 9, the pixel circuit 200 and the light-emittingelement 500 may be formed on the substrate 100 when the display panel 10as described above is manufactured. In this case, the recess 310A may beformed while the pixel circuit 200 is formed.

In the case of fabricating the light-emitting element 500, theintermediate layer 520 and the opposite electrode 530 may be formed overthe entire surface of the substrate 100. For example, the firstfunctional layer 521, the second functional layer 523, and the oppositeelectrode 530 may be disposed over the entire surface of the substrate100, and a plurality of emission layers 522 may be spaced apart fromeach other over the entire surface of the substrate 100 and have auniform pattern.

In this case, the intermediate layers 520 and/or the opposite electrode530 may he disposed in the opening area OP and the second non-displayarea NDA2. For example, the first functional layer 521, the secondfunctional layer 523, and/or the first dummy emission layer 522A may bedisposed in the second non-display area NDA2. Also, the first functionallayer 521, the second functional layer 523, and/or a second dummyemission layer 522B may be disposed in the opening area OP. At least onefirst dummy emission layer 522A may be formed in the second non-displayarea NDA2 and a plurality of emission layers 522 may be disposed to bespaced apart from each other in the second non-display area NDA2. Inaddition, at least one second dummy emission layer 522B may be formed inthe opening area OP, and a plurality of second dummy emission layers522B may be spaced apart from each other in the opening area OP.Hereinafter, for convenience of description, the case where a firstfunctional layer 521 at least one first dummy emission layer 522A, asecond functional layer 522A, and an opposite electrode 530 are formedin the second non-display area NDA2 and the opening area OP will bemainly described in detail.

The insulating layer 110 might not be disposed con the substrate 100 ina portion of the second non-display area NDA2. After the insulatinglayer 110 is formed on the substrate 100, the insulating layer 110 maybe removed when the recess 310A is formed, as described above. Accordingto an exemplary embodiment of the present disclosure, the insulatinglayer 110 might not be formed in the second non-display area NDA2.According to an exemplary embodiment of the present disclosure, theinsulating layer 110 may be formed in the second non-display area NDA2and then might not be removed from the second non-display area NDA2.Hereinafter, for convenience of description, the case where theinsulating layer 110 is formed in the second non-display area NDA2 andthen disposed in the second non-display area NDA2 will be mainlydescribed in detail.

The sealing portion 600 may be disposed on the recess 310A, and theposition of the substrate 100 and the position of the encapsulatingsubstrate 700 may be aligned. For example, an alignment mark may beformed in each of the encapsulating substrate 700 and the substrate 100.For example, a first alignment mark AL1 may be formed in the substrate100, and a second alignment mark AL2 may be formed in the encapsulatingsubstrate 700. Each of the first alignment mark AL1 and the secondalignment mark AL2 may have a particular shape such as a cross shape. Inthis case, the first alignment mark AL1 and the second alignment markAL2 may be disposed at various positions of the substrate 100 and theencapsulating substrate 700, respectively. For example, the firstalignment mark AL1 and the second alignment mark AL2 may be disposed inan edge portion of the substrate 100 and an edge portion of theencapsulating substrate 700, respectively, and disposed in the secondnon-display area NDA2. A plurality of first alignment marks AL1 and aplurality of second alignment marks AL2 may be provided. In this case,each of the first alignment marks AL1 and each of the second alignmentmarks AL2 may be disposed at positions corresponding to each other whenthe substrate 100 and the encapsulating substrate 700 are arranged tooverlap each other. Hereinafter, for convenience of description, thecase where the first alignment mark AL1 and the second alignment markAL2 are disposed in the second non-display area NDA2 of the substrate100 and the second non-display area NDA2 of the encapsulating substrate700, respectively will be mainly described in detail. When the positionsof the substrate 100 and the encapsulating substrate 700 are aligned,the first alignment mark AL1 and the second alignment mark AL2 may bealigned with each other. For example, the first alignment mark AL1 andthe second alignment mark AL2 may be photographed through a vision unitsuch as a separately provided camera or the like to determine relativepositions of the substrate 100 and the encapsulating substrate 700, andthen the position of the substrate 100 and/or the encapsulatingsubstrate 700 may be varied to thereby align the substrate 100 and theencapsulating substrate 700.

After the position of the substrate 100 and the position of theencapsulating substrate 700 are aligned with each other, theencapsulating substrate 700 may be placed on the sealing portion 600.The sealing portion 600 may be cured by providing energy to the sealingportion 600. In this case, the encapsulating substrate 700 may be in astate, in which the through hole 710 has been formed, before beingplaced on the sealing portion 600. For example, when the encapsulatingsubstrate 700 includes glass, the through hole 710 may be formed in theencapsulating substrate 700 through a drill, a laser, or the like afterthe encapsulating substrate 700 is manufactured. According to anexemplary embodiment of the present disclosure, when the encapsulatingsubstrate 700 includes plastic, the encapsulating substrate 700 may beformed through extrusion molding, and in this case, the encapsulatingsubstrate 700 may be manufactured with the through hole 710 formedtherein. The encapsulating substrate 700 having the through hole 710 isnot limited to the above-described process, and the present disclosureincludes all the cases in which the through hole 710 is formed when theencapsulating substrate 700 is manufactured or after the encapsulatingsubstrate 700 is manufactured.

As described above, when the recess 310A is provided, moisture or oxygenmay be prevented by the recess 310A from moving toward thelight-emitting element 500. In addition, a portion of the sealingportion 600 may be inserted into the recess 310A to increase a contactarea between an uneven portion including the recess 310A and the sealingportion 600, and thus, the sealing portion 600 may be firmly fixed. Theopposite electrode 530 might not be partially formed in a part of aportion 311A disposed on the uppermost side of the recess 310A when theopposite electrode 530 is formed, and thus, a portion of the recess 310Aand the sealing portion 600 may be in contact with each other. In thiscase, the sealing portion 600 may contact the second functional layer523 on a partition wall of the recess 310A through the portion 311Adisposed on the uppermost side of the recess 310A, and thus, the secondfunctional layer 523 may be firmly coupled to the sealing portion 600.

After the encapsulating substrate 700 is fixed by the sealing portion600, as described above, a cleaning liquid may be sprayed into thethrough hole 710 by using a cleaning liquid supply portion CS. Thecleaning liquid may be received in the second sealing portion 600B,which surrounds the through hole 710 around the through hole 710, toremove the first functional layer 521, the second dummy emission layer522B, the second functional layer 523, and the opposite electrode 530,which are disposed on an area of the substrate 100 that is partitionedby the second sealing portion 600B.

The cleaning liquid as described above may be various. For example, thecleaning liquid may include ethyl acetate and/or dimethyl chloride,which are capable of removing both the intermediate layer 520 and theopposite electrode 530. Also, the cleaning liquid may include an acidicliquid including hydrofluoric acid (HF), hydrochloric acid (HCL), and/ornitric acid (NO₃), which are capable of removing the opposite electrode530. The cleaning liquid may include an organic solvent includingisopropyl alcohol, an aromatic, compound and/or an aliphatic compound,which are capable of removing the intermediate layer 520. The cleaningliquid is not limited to the above and may include any type of solventcapable of removing the opposite electrode 530 and/or the intermediatelayer 520.

Then, the input sensing member 40 and then optical functional member 50may be formed or, attached on the encapsulating substrate 700. Accordingto an exemplary embodiment of the present disclosure, the opticalfunctional member 50 and the input sensing member 40 may be formed orattached on the display panel 10.

In this case, after the encapsulating substrate 700 is fixed to thesealing portion 600, a separate opening might not be formed in theencapsulating substrate 700. For example, when the encapsulatingsubstrate 700 is fixed to the sealing portion 600 and then the throughhole 710 is formed in the encapsulating substrate 700, unlike the abovedescription, the encapsulating substrate 700 may be damaged or thesubstrate 100 may be damaged. When the encapsulating substrate 700without the through hole 710 is fixed to the sealing portion 600 and thethrough hole 710 is then formed by irradiating the encapsulatingsubstrate 700 with a laser beam, the intermediate layer 520 or thelight-emitting element 500, which is present near the through hole 710,may be damaged. In addition, when a mechanical method using a drill orthe like is used to form the through hole 710 in the encapsulatingsubstrate 700, a manufacturing time may increase.

However, when the through hole 710 is formed in the encapsulatingsubstrate 700 and then fixed to the sealing portion 600 as describedabove, the problems as described above may be solved.

FIG. 10 is a cross-sectional view illustrating a display panel accordingto an exemplary embodiment of the present disclosure. In FIG. 10, thesame reference numerals as those in FIG. 6 denote the same members asthose in FIG. 6, and thus, detailed descriptions thereof will beomitted.

Referring to FIG. 10, the display panel 10 may further include acladding layer 320A.

The cladding layer 320A at least partially overlaps a recess 310A tocover the recess 310A. The cladding layer 320A may be disposed directlyon an insulating layer 110 having the recess 310A so as to directlycontact the recess 310A, and a portion of the cladding layer 320A may bedisposed in the recess 310A.

The cladding layer 320A may include an organic insulating material. Forexample, the cladding layer 320A may include the same material as thevia insulating layer 130 and/or the pixel-defining layer 150 describedabove. In this case, the cladding layer 320A may provide a relativelyflat top surface while covering the recess 310A. According to anexemplary embodiment of the present disclosure, the cladding layer 320Amay include one or more of the intermediate layers 520 described above.For example, the, cladding layer 320A may include a first functionallayer 521, an emission layer 522, and/or a second functional layer 523.In this case, the cladding layer 320A may be formed in a shape similarto the recess 310A along the outer surface of the recess 310A.

The cladding layer 320A reduces stress in a portion, in which the recess310A is formed, of the insulating layer 110 which is an inorganic layer,and prevents a crack from propagating. The cladding layer 320A coversthe recess 310A and thus may prevent particles generated during themanufacturing process from being stored in the recess 310A and moving tothe light-emitting element 500 of the pixel P to cause a dark spot. Inaddition, the cladding layer 320A may block some of moisture or oxygenmoving from the outside to the light-emitting element 500.

The first functional layer 521 and the second functional layer 523 maybe formed exclusively in the display area DA. The emission layer 522 maybe patterned such that patterns thereof are spaced apart from each otherover the entire surface of the substrate 100. According to an exemplaryembodiment of the present disclosure, the first functional layer 521 andthe second functional layer 523 may be formed exclusively in the displayarea DA and the emission layer 522 may also be patterned exclusively inthe display area DA. According to an exemplary embodiment of the presentdisclosure, the first functional layer 521, the emission layer 522, andthe second functional layer 523 may be patterned exclusively in thedisplay area DA or over the entire surface of the substrate 100.According to an exemplary embodiment of the present disclosure, the lustfunctional layer 521, the emission layer 522, and the second functionallayer 523 may be formed in pattern forms on an area of the substrate 100except for the first non-display area NDA1, or may be formed over theentire surface of the substrate 100 except for the first-non displayarea NDA1. Hereinafter, for convenience of description, the case wherethe first functional layer 521 and the second functional layer 523 areformed exclusively in the display area DA and the emission layer 522 isformed over the entire surface of the substrate 100 will be mainlydescribed in detail.

The opposite electrode 530 may be disposed over the entire surface of adisplay substrate 100 except for the second non-display area NDA2 andthe opening area OP. In this case, the opposite electrode 530 might notbe deposited on a portion 321A of the upper surface of the claddinglayer 320A or might not be deposited well on the portion 121A than onother portions, and thus, the portion 321A of the upper surface of thecladding layer 320A may be exposed to the outside and may contact thesecond sealing portion 600B.

FIGS. 11 to 13 are cross-sectional views illustrating a method ofmanufacturing the display panel 10 shown in FIG. 10.

Referring to FIGS. 11 to 13, when the display panel 10 is manufactured,the pixel circuit 200 and the light-emitting element 500 may be formed.The recess 310A and the cladding layer 320A may be formed before thelight-emitting element 500 is formed.

When the light-emitting element 500 is formed as described above, eachof the first functional layer 521, the second functional layer 523, andthe opposite electrode 530 may be formed over the entire surface of thesubstrate 100. Also, a plurality of emission layers 522 may be formedover the entire surface of the substrate 100 to be spaced apart fromeach other. According to an exemplary embodiment of the presentdisclosure, the first functional layer 521 and the second functionallayer 523 may be formed exclusively in the display area DA and theopposite electrode 530 alone may be formed over the entire surface ofthe substrate 100. Also, a plurality of emission layers 522 may beformed over the entire surface of the substrate 100 to be spaced apartfrom each other. According to an exemplary embodiment of the presentdisclosure, the first functional layer 521, the emission layer 522, andthe second functional layer 523 may be patterned exclusively in thedisplay area DA or over the entire surface of the substrate 100.According to an exemplary embodiment of the present disclosure, thefirst functional layer 521, the emission layer 522, and the secondfunctional layer 523 may be formed in pattern forms on an area of thesubstrate 100 except for the first non-display area NDA1, or may beformed over the entire surface of the substrate 100 except for the firstnon-display area NDA1. Hereinafter, for convenience of description, thecase where only the opposite electrode 530 is formed over the entiresurface of the substrate 100 and a plurality of emission layers 522 areformed spaced apart from each other over the entire surface of thesubstrate 100 will be mainly described in detail.

After the pixel circuit 200 and the light-emitting element 500 areformed, the sealing portion 600 may be formed on the recess 310A and thecladding layer 320A and then the encapsulating substrate 700 may bedisposed. In this case, the encapsulating substrate 700 and thesubstrate 100 may be aligned with each other. The encapsulatingsubstrate 700 and the substrate 100 may be aligned with each other toallow the through hole 710 of the encapsulating substrate 700 to bedisposed within the second sealing portion 600B.

When alignment between the encapsulating substrate 700 and the substrate100 is completed, the encapsulating substrate 700 and the substrate 100may be fixed by curing the sealing portion 600. Then, a cleaning liquidmay be supplied into the through hole 710 by a cleaning liquid supplyportion CS. In this case, the cleaning liquid may remove the seconddummy emission layer 522B and the opposite electrode 530 disposed in theopening area OP.

In addition, as shown in FIG. 2 or 3, the display device 1 may bemanufactured by arranging various members on the display panel 10.

Accordingly, the display device 1 may securely fix the second sealingportion 600B and may also effectively block moisture or oxygen frompenetrating between the second sealing portion 600B and the recess 310A.In addition, the display device 1 may maintain a strong coupling betweenthe second sealing portion 600B and the cladding layer 320A as a portionof the cladding layer 320A, of which constituent is similar to that ofthe second sealing portion 600B, is exposed and contacts the secondsealing portion 600B.

The method of manufacturing the display device might not includeprocessing the through hole 710 after the manufacturing of the displaypanel I0 and thus may prevent breakage or damage of the display panel10, which may occur during the processing of the through hole 710.

In addition, as the method of manufacturing the display device does notinclude processing the through hole 710 after the manufacturing of thedisplay panel 10, the method may shorten the time required forprocessing the through hole 710.

FIG. 14 is a cross-sectional view illustrating a display panel accordingto an exemplary embodiment of the present disclosure. In FIG. 14, thesame reference numerals as those in FIG. 6 or 10 denote the sameelements as those in FIG. 6 or 10, and thus, detailed descriptionsthereof will be omitted.

Referring to FIG. 14, an opposite electrode 530 may be formedexclusively in a display area DA. In addition, a cladding layer 320A maybe disposed on a recess 310A. In this case, the cladding layer 320A maybe a first functional layer 521, an emission layer 522, and/or a secondfunctional layer 523. Hereinafter, for convenience of description, thecase where the cladding layer 320A is the emission layer 522 will bemainly described in detail.

When the emission layer 522 is formed, a portion of the emission layer522 may be disposed in the recess 310A to form the cladding layer 320A.A sealing portion 600 may be disposed on the cladding layer 320A. Inthis case, both the cladding layer 320A and the sealing portion 600include organic materials and thus may be firmly coupled to each other.The embodiment is not limited thereto and may have a structure in whichthe cladding layer 320A is not present.

FIGS. 15 and 16 are cross-sectional views illustrating a method ofmanufacturing the display panel shown in FIG. 14.

Referring to FIGS. 15 and 16, the method of manufacturing the displaypanel is the same as or similar to that described above.

For example, a pixel circuit 200 and a light-emitting element 500 may beformed on a substrate 100. An opposite electrode 530 may be formedentirely over the substrate 100 except for an opening area OP. Forexample, the opposite electrode 530 may be formed in a first non-displayarea NDA1, a display area DA, and a second non-display area NDA2. Inthis case, a mask used in forming the opposite electrode 530 may block adeposition material from reaching the opening area OP. According to anexemplary embodiment of the present disclosure, the opposite electrode530 may be fined in some of the first non-display area NDA1, the displayarea DA, and the second non-display area NDA2. According to an exemplaryembodiment of the present disclosure, the opposite electrode 530 may beformed exclusively in the display area DA. For example, the mask used informing the opposite electrode 530 may block a deposition materialmoving to the first non-display area NDA1, the opening area OP, and thesecond non-display area NDA2. In this case, the opposite electrode 530might not be formed in the first non-display area NDA1, the opening areaOP, and the second non-display area NDA2 but may be formed exclusivelyin the display area DA. Hereinafter, for convenience of description, thecase where the opposite electrode 530 is formed exclusively in thedisplay area DA will be mainly described in detail.

After the pixel circuit 200 and the light-emitting element s00 areformed, a sealing portion 600 may be disposed on a cladding layer 320A.In this case, an insulating layer 110 might not be removed from theopening area OP. Then, an encapsulating substrate 700 having a throughhole 710 may be disposed to face the substrate 100, and theencapsulating substrate 700 and the substrate 100 may be coupled to eachother through the sealing portion 600.

After the sealing portion 600 is cured, a cleaning liquid supply portionCS may spray a cleaning liquid through the through hole 710 of theencapsulating substrate 700. In this case, the cleaning liquid may enterthe through hole 710 and be accommodated in a space formed by thesubstrate 100 and a second sealing portion 600B. For example, thecleaning liquid may remove a second dummy emission layer 522B disposedin the opening area OP.

When the above process is completed, the cleaning liquid may be removedand another member may be disposed on the display panel 10 and fixed tothe display panel 10, as shown in FIG. 2 or 3. The manufacturing methodis not limited to that described above and may be performed in the samemanner even when the opposite electrode 530 and the second dummyemission layer 522B are disposed in the opening area OP, as describedwith reference to FIGS. 7 to 10.

FIG. 17 is a cross-sectional view illustrating a display panel accordingto an exemplary embodiment of the present disclosure. In FIG. 1,7, thesame reference numerals as those in FIG. 14 denote the same elements asthose in FIG. 14, and thus, detailed descriptions thereof will beomitted.

Referring to FIG. 17, an opposite electrode 530 may be disposedexclusively in a display area DA, as shown in FIG. 14. In this case, acladding layer 320A may be disposed in a recess 310A. The cladding layer320A may have the same shape as that described with reference to FIG.10.

In this case, a sealing portion 600 may be firmly fixed due to thecladding layer 320A, and moisture or oxygen from the outside may beprevented from flowing into a light-emitting element 500.

FIGS. 18 and 19 are cross-sectional views illustrating a method ofmanufacturing the display panel shown in FIG. 17.

Referring to FIGS. 18 and 19, the display panel 10 may be manufacturedby a method that is the same as or similar to that described above.

For example, a pixel circuit 200 and a light-emitting element 500 may beformed on a substrate 100. In this case, an opposite electrode 530 maybe formed exclusively in a display area DA and might not be formed in anopening area OP, a second non-display area NDA2, or a first non-displayarea.

An encapsulating substrate 700 may be fixed to a second sealing portion600B by aligning the encapsulating substrate 700 with a substrate 100after the second sealing portion 600B is disposed on a cladding layer320A. In this case, the encapsulating substrate 700 and the substrate100 may be fixed by a first sealing portion 600A as well as the secondsealing portion 600B. Also, in this case, a through hole 710 may beformed in the encapsulating substrate 700.

After a sealing portion 600 is cured, a cleaning liquid supply portionCS may remove a second dummy emission layer 522B of the opening area OPby spraying a cleaning liquid through the through hole 710.

Then, the cleaning liquid may be removed, and another member may bedisposed on the display panel 10 and fixed to the display panel 10, asshown in FIG. 2 or 3.

The manufacturing method is not limited to that described above and maybe performed in the same manner even when the opposite electrode 530 andthe second dummy emission layer 522B are disposed in the opening areaOP, as described with reference to FIGS. 7 to 10.

FIG. 20 is a cross-sectional view illustrating a display panel accordingto an exemplary embodiment of the present disclosure.

Referring to FIG. 20, in the display panel 10, only a first functionallayer 521 and a second functional layer 523 of an intermediate layer 520may be disposed over the entire surface of a substrate 100. In thiscase, an emission layer 522 may be patterned exclusively at an openingof a pixel-defining layer 150. For example, a plurality of emissionlayers 522 may be spaced apart from each other exclusively in a displayarea DA.

The display panel 10 may be manufactured similar to that shown in FIGS.7 to 9. For example, a pixel circuit 200 and a light-emitting element500 may be formed on the substrate 100. In this case, a first functionallayer 521, a second functional layer 523, and an opposite electrode 530may be disposed over the entire surface of the substrate 100.

Then, a sealing portion is disposed on a pattern portion 300A, and thenan encapsulating substrate 700 having a through hole 710 is placed andfixed.

After the above process is completed, a cleaning liquid may be sprayedthrough the through hole 710 to remove the opposite electrode 530, thesecond functional layer 523, and the first functional layer 521 disposedin the opening area OP.

The display panel 10 is not limited to the above, and in an embodiment,only the opposite electrode 530 of the opening area OP may be removed.

The display panel 10 shown in FIG. 20 is not limited to the above andmay selectively include the structure described above.

FIG. 21 is a cross-sectional view illustrating, a display panelaccording to an exemplary embodiment of the present disclosure.

Referring to FIG. 21, in the display panel 10, a first functional layer521, an emission layer 522, and/or a second functional layer 523 of anintermediate layer 520 may be disposed over the entire surface of asubstrate 100. In this case, an opposite electrode 530 might not bedisposed in an opening area OP. Hereinafter, for convenience ofdescription, the case where the first functional layer 521, the emissionlayer 522, and the second functional layer 523 are disposed over theentire surface of the substrate 100 and the opposite electrode 530 isdisposed over the substrate in an area other than the opening area OPwill be mainly described in detail.

In the display panel 10 as described above, a first sealing portion anda second sealing portion 600B may be disposed after a pixel circuit 200and a light-emitting element 500 is formed on a substrate 100, and anencapsulating substrate 700 having a through hole 710 may be fixed tothe first sealing portion and the second sealing portion 600B.

Then, as shown in FIG. 9, the opposite electrode 530 of the opening areaOP may be selectively removed by spraying a cleaning liquid through thethrough hole 710. In this case, the cleaning liquid may be the same asor similar to those described above. According to an exemplaryembodiment of the present disclosure, the cleaning liquid may include anacidic liquid including HF, HCL, and/or NO₃. In this case, the oppositeelectrode 530 may be selectively removed and thus at least a portion ofthe intermediate layer 520 may remain in the opening area OP.

When the opposite electrode 530 is removed through the cleaning liquid,the first functional layer 521, the emission layer 522, and/or thesecond functional layer 523 may remain in the opening area OR. In thiscase, the intermediate layer 520 remaining in the opening area OP mightnot block light incident on a component or light emitted from thecomponent when the component operates.

The display panel 10 is not limited to the above, and a second dummyemission layer 522B might not be disposed in the opening area OP.According to an exemplary embodiment of the present disclosure, theintermediate layer 520 of the opening area OP may be completely removed.

The display panel 10 shown in FIG. 21 is not limited to the above andmay include selectively include the structure described above.

FIG. 22 is a cross-sectional view illustrating a display panel accordingto an exemplary embodiment of the present disclosure.

Referring to FIG. 22, one or more of the layers in an intermediate layer520 and an opposite electrode 530 may be disposed in an opening area OPof the display panel 10. Hereinafter, for convenience of description,the case where a first functional layer 521, a second dummy emissionlayer 522B, a second functional layer 523, and the opposite electrode530 are disposed in the opening area OP will be mainly described indetail.

In the display panel 10, a sealing portion may be disposed after a pixelcircuit 200 and a light-emitting element 500 are formed on a substrate100, and then an encapsulating substrate 700 having a through hole 710formed therein may be fixed to the sealing portion. In this case, thethrough hole 710 may be formed when the encapsulating substrate 700 ismanufactured, as described above, or may be formed before theencapsulating substrate 700 is attached to the sealing portion after theencapsulating substrate 700 is manufactured.

After the encapsulating substrate 700 is fixed to the sealing portion,as described above, a cleaning liquid might not be sprayed through thethrough hole 10.

The display panel 10 shown in FIG. 22 is not limited to the above andmay selectively include the structure described above.

FIG. 23 is a cross-sectional view illustrating a display panel accordingto an exemplary embodiment of the present disclosure.

Referring to FIG. 23, the display panel 10 may include an intermediatelayer 520 patterned over a substrate 100, the intermediate layer 520including a plurality of layers that are spaced apart from each other.In this case, as an embodiment, the intermediate layer 520 may bepatterned over the entire surface of the substrate 100. According to anexemplary embodiment of the present disclosure, the intermediate layer520 may be patterned exclusively in a display area DA. According to anexemplary embodiment of the present disclosure, the intermediate layer520 may be patterned over an area of the substrate 100 except for afirst non-display area. According to an exemplary embodiment of thepresent disclosure, the intermediate layer 520 may be patterned in anopening area OP and the display area DA. Hereinafter, for convenience ofdescription, the case where the intermediate layer 520 is patterned overthe entire surface of the substrate 100 will be mainly described indetail.

The display panel 10 may include a dummy wiring 800. The dummy wiring800 may be disposed in the first non-display area and a secondnon-display area NDA2 and may be disposed between an insulating layer110 and a sealing portion. In this case, the dummy wiring 800 disposedin the second non-display area NDA2 may be disposed between a secondsealing portion 300B and a pixel circuit 200. According to an exemplaryembodiment of the present disclosure, although not shown in thedrawings, the dummy wiring 800 may be disposed between the secondsealing portion 300B and the opening area OP. In this case, the dummywiring 800 may be arranged such that at least a portion of the dummywiring 800 overlaps the second sealing portion 300B. The dummy wiring800 may be configured to apply energy to the second sealing portion 300Bwhen external power is applied to the dummy wiring 800, to thereby meltthe second sealing portion 300B or to make the second sealing portion300B attachable to an encapsulating substrate 700. A dummy wiringdisposed in the first non-display area may be the same as or similar tothe dummy wiring 800 disposed in the second non-display area NDA2.

A first alignment mark AL1 may protrude from the substrate 100 towardthe encapsulating substrate 700. In this case, the first alignment markAL1 may be formed of the same material as a source electrode 215S and/ora drain electrode 215D when the source electrode 215S and/or a drainelectrode 215D is formed.

A second alignment mark AL2 may protrude from the encapsulatingsubstrate 700 toward the substrate 100. In this case, the secondalignment mark AL2 may be formed by patterning a metal or the like.According to an exemplary embodiment of the present disclosure, thesecond alignment marks AL2 may include various materials such as ink,film, and the like.

The display panel 10 may be manufactured similar to that describedabove. As an embodiment, the encapsulating substrate 700 may be fixed toa sealing portion alter the intermediate layer 520 and an oppositeelectrode 530 are formed as shown in FIGS. 6 to 9, and then theintermediate layer 520 and the opposite electrode 530 of the openingarea OP may be removed by spraying a cleaning liquid through the throughhole 710.

The display panel 10 shown in FIG. 23 is not limited to the above andmay selectively include the structure described above.

FIG. 24 is a cross-sectional view illustrating a display panel accordingto an exemplary embodiment of the present disclosure.

Referring to FIG. 24, the display panel 10 may include a substrate 100,a pixel circuit 200, a light-emitting element 500, an encapsulatingsubstrate 700 having a through hole 710 formed therein, a sealingportion, and a dummy wiring 800. The substrate 100, the pixel circuit200, the light-emitting element 500, the encapsulating substrate 700having the through hole 710 formed therein, the sealing portion, and thedummy wiring 800 are the same as or similar to those described above,and thus, detailed descriptions thereof will be omitted.

In the display panel 10, the pixel circuit 200 and the light-emittingelement 500 may be formed on the substrate 100. In this case, a firstfunctional layer 521, a second functional layer 523, and an oppositeelectrode 530 may be disposed in each of a display area DA, a secondnon-display area NDA2, and an opening area OP.

Then, the encapsulating substrate 700 having the through hole 710 may bedisposed in a second sealing portion 300B after the second sealingportion 300B is disposed on the opposite electrode 530. Then, theencapsulating substrate 700 may be fixed to the second sealing portion300B by applying energy to the second sealing portion 300B through thedummy wiring 800. In this case, energy may be applied to the secondsealing portion 300B from the dummy wiring 800 or may be applied to thesecond sealing portion 300B through ultraviolet (UV) rays or the like.

Then, the first functional layer 521, the second functional layer 523,and the opposite electrode 530 disposed in the opening area OP may beremoved by spraying a cleaning liquid through the through hole 710.

The display device according to embodiments may prevent an area aroundan opening of an encapsulating substrate from being broken when adisplay panel including an opening area is manufactured.

In the display device according to embodiments, defects might not occuras the encapsulating substrate is not broken, and moisture and oxygenflowing into a display layer may be effectively blocked.

The method of manufacturing a display device, according to embodiments,may shorten the time required for manufacturing a display panelincluding an opening area.

The method of manufacturing a display device, according to embodiments,may reduce defects in manufacturing the display device.

It should be understood that the exemplary embodiments of the presentdisclosure described herein should be considered in a descriptive senseand that various changes may be made to these described embodimentswithout departing from the inventive concepts described herein. Thedescriptions of features or aspects within each embodiment shouldtypically be considered as available for other similar features oraspects in other embodiments and so the disclosed features and aspectsmay be mixed and matched to form new movements. While one or moreembodiments have been described with reference to the figures, it willbe understood by those of ordinary skill in the art that various changesin form and details may be made therein without departing from thespirit and scope of the present disclosure.

What is claimed is:
 1. A display device, comprising: a substrateincluding a display area, an opening area disposed in the display area,a first non-display area at least partially surrounding the displayarea, and a second non-display area at least partially surrounding theopening area; a display layer disposed in the display area; anencapsulating substrate at least partially covering the display layerand having an opening corresponding to the opening area; a sealingportion disposed between the encapsulating substrate and the substrate,the sealing portion being disposed in the opening area and connectingthe encapsulating substrate to the substrate; and a partition walldisposed between the substrate and the sealing portion.
 2. The displaydevice of claim 1, wherein the sealing portion is in direct contact withthe partition wall.
 3. The display device of claim 1, wherein thepartition wall comprises an inorganic layer and/or an organic layer. 4.The display device of claim 3, wherein the sealing portion is in contactwith the organic layer of the partition wall.
 5. The display device ofclaim 1, wherein an inner surface of the opening of the encapsulatingsubstrate protrudes from the inside of the sealing portion towards thecenter of the opening.
 6. The display device of claim 1, wherein thesubstrate and the encapsulating substrate each comprise an alignmentmark disposed at corresponding positions.
 7. A method of manufacturing adisplay device, the method comprising: forming a display layer on asubstrate; arranging a sealing portion on the substrate; arranging anencapsulating substrate facing the substrate, the encapsulatingsubstrate including an opening corresponding to an opening area of thesubstrate; coupling the substrate to the encapsulating substrate usingthe sealing portion; and supplying a cleaning liquid through the openingto remove a portion of the display layer inside the opening.
 8. Themethod of claim 7, wherein the cleaning liquid removes an oppositeelectrode and/or an intermediate layer in the display layer.
 9. Themethod of claim 7, further comprising: forming a partition wall in theopening area corresponding to the opening.
 10. The method of claim 9,wherein the partition wall is arranged in correspondence with a positionwhere the sealing portion is disposed.
 11. The method of claim 9,wherein an inner surface of the opening of the encapsulating substrateprotrudes from the inside of the sealing portion towards the center ofthe opening.
 12. The method of claim 7, wherein the opening of theencapsulating substrate is formed by a laser or a drill.
 13. The methodof claim 7, wherein the encapsulating substrate comprises plastic and isformed by an extrusion process.
 14. The method of claim 7, furthercomprising: aligning the substrate with the encapsulating substrate. 15.A method of manufacturing a display device, the method comprising:forming an intermediate layer in both a display area and an opening areaof a substrate and forming an opposite electrode on a region of thesubstrate that is not the opening area; arranging a sealing portion inthe opening areas; arranging an encapsulating substrate facing thesubstrate, the encapsulating substrate including an openingcorresponding to the opening area; coupling the substrate to theencapsulating substrate using the sealing portion; and supplying acleaning liquid through the opening to remove the intermediate layerinside the opening.
 16. The method of claim 15, further comprising:aligning the substrate with the encapsulating substrate.
 17. The methodof claim 15, further comprising: forming a partition wall on thesubstrate.
 18. The method of claim 17, wherein at least a portion of thesealing portion is arranged on the partition wall.
 19. The method ofclaim 15, wherein the partition wall comprises an inorganic layer and/oran organic layer.
 20. The method of claim 15, wherein the opening isformed, after the encapsulating substrate is formed, using a laser or adrill, or the encapsulating substrate is formed, by extrusion molding,to have the opening defined therein.